Press for manufacturing multilayer boards
- Presses rigid and flexible materials
- Suitable for RF materials
- Preset and individual process profiles
Press for manufacturing multilayer boards
Special process profiles ensure reliable bonding of RF materials
The LPKF MultiPress S presses multilayer circuits from rigid, rigid-flex and flexible PCB materials. Process control provides for a homogeneous material compound. Efficient heat dissipation assures short cooling phases. The result is optimum process times.