Pick & Place System
- Pick & Place machine with camera-supported precision
- For chip designs from 0201 to 40 x 80 mm
- Automatic nozzle changer with 6 nozzles
- Intuitive graphical user interface
- CAD editor for all CAD systems
LPKF ProtoPlace S4 Pick & Place System
SMD Pick & Place Machine for PCB Prototypes and Low Volumes
Quick and easy positioning
The LPKF Edition SMT ProtoPlace S4 series are pick & place systems for SMD placement of PCB prototypes and small series in the laboratory. Optionally, the ProtoPlace S4 is also available with dispensing function for solder pastes and feeder portal.
Information
The LPKF Edition SMT ProtoPlace S4 pick & place machines feature easy operation and high precision. In all the different versions, use of standard and fine-pitch SMD components and placement of SOIC, PLCC, BGA, μBGA, CSP, QFN, and LEDs are possible.
Thanks to the intuitive software interface, setup times are short – even for occasional users. The software guides the user through each step in the process. After each process step, the user confirms the function and is automatically guided to the next step. This is controlled via the integrated PC, which thus assumes the tasks of data preparation and machine control. The work area for the material and the positions of individual machine components such as the bottom camera, the nozzle changer, or the component holder are shown in the graphical display.
Component holders for belts, bars, trays and bulk material can be placed on the max. 540 mm x 480 mm working area. All placement systems in the series feature optical centring, a top camera for automatic fiducial correction and a bottom camera for automatic component centring. The cameras also allow optical inspection of solder paste pressure and component placement.
System options
In addition to the basic system, LPKF offers options with additional functions: The ProtoPlace S4 is also available with a non-contact dispensing head for applying solder paste, with the ‘Smart Automatic Feeder’ to support the user with higher throughput of PCBs, and with both additional options.
