The connection of two or more layers is an indispensable part of PCB prototyping. The compact LPKF Contac S4 with six baths reliably performs this task: The board is routed through all stages of a bath cascade. In this way, homogeneous copper layers are produced on the walls of all through-holes, even with multilayer boards. The Contac S4 processes up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). The LPKF Contac S4 offers a final tin bath to protect the surface and improve solderability.
Improved copper layer structure
The powerful technology of the LPKF Contac S4 improves the build-up of the copper layer. Optimized anode plates and reverse pulse plating ensure uniform deposition, and activation via black hole technology, an integrated air flow and an additional process step for cleaning the through-holes provide secure connections to the surface copper without interfering interfaces. The result is uniform layer thicknesses in the holes and on the flat metal surface of the substrate.
The integrated touch control panel guides even inexperienced users safely through the electroplating process with an assistant and parameter management. Ambitious developers can use customized settings at any time. No chemical knowledge or bath analyses are required for the process, the system automatically indicates necessary maintenance tasks. Another new feature is the chemical-resistant housing with improved protection against dyeing – the Contac S4 combines high functionality and practical suitability.
Safe through-hole plating in the development laboratory: The LPKF Contac S4 not only reliably and evenly plates through double-sided printed circuit boards, but also the cores of multilayers.